• ICESP Topics

    Analog and Mixed Signal Processing
    Array Signal Processing
    Digital Signal Processing
    Signal Processing for Communications

    CFP Flyer
  • Submission

    Manuscripts should be submitted by one of the authors of the manuscript (PDF or Word files) through the Online Submission System or Email: icesp_conf@163.com

    Online Submission System
  • Important Dates

    Submission Deadline:
    December 15, 2022
    Notification Due:
    December 25, 2022
    Registration Deadline:
    December 30, 2022

2023 4th International Conference on Electronics and Signal Processing

Join Us

Welcome to ICESP 2023

2023 4th International Conference on Electronics and Signal Processing (ICESP 2023) will be held in Macau, China  during January 13-15, 2023 jointly with IPMV 2023, co-sponsored by University of Macau. This year we are seeking innovative, high-quality and potentially interdisciplinary proposals for technical sessions that complement the regular program of the conference. The sessions should be focused and provide both an overview of the state-of-the-art, as well as highlight the most promising research directions, trends and challenges in the proposed field of electronics and signal processing.

The conference provides academics, researchers, developers, practitioners, and professional from all over the world a forum for discussion and exchange of ideas concerning theoretical and practical aspects of electronics and signal processing.

Note: As the world is now experiencing the widespread sustained transmission of respiratory illness caused by COVID-19, with the consideration of the health and safety of all our participants, the conference organizing committee of ICESP 2023 will pay close attention to the situation and adjust the meeting format.


Submissions will be peer reviewed by both the conference scientific committees and journal editorial board. All registered and presented papers will be published in Springer book series-Signals and Communication Technology, submitted for Scopus, EI Compendex, SCImago, zbMATH, etc. (PAPER TEMPLATE)

  • Submission and Review Process

    Submitted Papers to the conference will be subjected to the rigorous peer-review process and are expected to meet standards of academic excellence. ICESP 2023 will follow a double-blind reviewing process to make the review process as fair as possible, both reviewers' and authors' identities remain anonymous.

    All papers that conform to the submission guidelines will be peer-reviewed by at least 2-3 members of the Program Committee, which will take 15-20 working days before the result comes out. Authors will receive review comments via email and be required to do necessary revisions if the paper is accepted.

  • Plagiarism Against

    An Initial Plagiarism Check is carried out for every manuscript submitted to ICESP 2023, the "Similarity Index" should be below 20%.


Co-Sponsored by

Supported by


Speakers in ICESP

IEEE Fellow,
Prof. James Tin-Yau Kwok
The Hong Kong University of Science and Technology, Hong Kong, China
Prof. Chi Man Pun, University of Macau, Macau, China
Prof. Hong Lin, University of Houston-Downtown, Houston, Texas, USA
Prof. LEUNG Andrew C S, City Univesity of Hong Kong, Hong Kong, China