Analog and Mixed Signal Processing
Array Signal Processing
Digital Signal Processing
Signal Processing for Communications
Manuscripts should be submitted by one of the authors of the manuscript (PDF or Word files) through the Online Submission System or Email: icesp_conf@163.com
Online Submission SystemSubmission Deadline:
October 20, 2023
Notification Due:
November 10, 2023
Registration Deadline:
November 25 , 2023
2024 5th International Conference on Electronics and Signal Processing
Join Us2024 5th International Conference on Electronics and Signal Processing (ICESP 2024) will be held in Macau, China during January 12-14, 2024 jointly with IPMV 2024, co-sponsored by University of Macau. This year we are seeking innovative, high-quality and potentially interdisciplinary proposals for technical sessions that complement the regular program of the conference. The sessions should be focused and provide both an overview of the state-of-the-art, as well as highlight the most promising research directions, trends and challenges in the proposed field of electronics and signal processing.
The conference provides academics, researchers, developers, practitioners, and professional from all over the world a forum for discussion and exchange of ideas concerning theoretical and practical aspects of electronics and signal processing.
Note: Taking into account the various circumstances of the participants, ICESP will adopt all available social media methods, such as online/video presentation, etc, besides the regular presentation styles (oral & poster). The online/video presentation session will be arranged accordingly. Authors who cannot travel to Macau due to some sort of restriction can participate by submitting a recorded presentation and connecting at the time of their session on Zoom. |
Submissions will be peer reviewed by both the conference scientific committees and journal editorial board. All registered and presented papers will be published in Springer book series-Signals and Communication Technology, submitted for Scopus, EI Compendex, SCImago, zbMATH, etc. (PAPER TEMPLATE)
ICESP 2023 Proceedings Available Here: https://link.springer.com/book/9783031366697
Submitted Papers to the conference will be subjected to the rigorous peer-review process and are expected to meet standards of academic excellence. ICESP 2024 will follow a double-blind reviewing process to make the review process as fair as possible, both reviewers' and authors' identities remain anonymous.
All papers that conform to the submission guidelines will be peer-reviewed by at least 2-3 members of the Program Committee, which will take 15-20 working days before the result comes out. Authors will receive review comments via email and be required to do necessary revisions if the paper is accepted.
An Initial Plagiarism Check is carried out for every manuscript submitted to ICESP 2024, the "Similarity Index" should be below 20%.
Co-Sponsored by
Technically Supported by
Supported by
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IEEE Fellow, Prof. James Tin-Yau Kwok The Hong Kong University of Science and Technology, Hong Kong, China |
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Prof. Chi Man Pun, University of Macau, Macau, China |
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Prof. Hong Lin, University of Houston-Downtown, Houston, Texas, USA |
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Prof. LEUNG Andrew C S, City Univesity of Hong Kong, Hong Kong, China |
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